Home > Product Information > Semiconductor Manufacturing Equipment

• Semiconductor Wafer Slicing Equipment & Solar Cell Wafer Slicing Equipment

MWM series
Up-to-date Information

Semiconductor manufacturing equipment which we pride on its high quality and high accuracy
Taking advantage of mechatronics and knowhow amassed in our company, we, NTC launch constantly equipment of high quality and high accuracy to the market of semiconductor manufacturing equipment.
Solar cell manufacturing equipment which we boast of No. 1 worldwide market share.
Recently, we dispatched more than 1,000 sets of solar cell equipment to a solar cell market under the attention as one of new energy resouces. Furthermore, we will offer a high production technology and thin-wafer slicing technique to a growing solar cell market.
Challenge for a new market
Multi-wafer Maker, MWM series which allowed silicon wafer to be cut by the multi-wire saw for the first time in the world. Since then, every substrate material such as quartz and crystal can be sliced for liquid crystal industries. Besides, we are tackling a substrate slicing, and now we can slice hard materials such sapphire and magnetic materials. In addition, we propose a cutting equipment which meets the needs and wants of customers.
 
Line-ups of semiconductor wafer slicing equipment and solar cell wafer slicing equipment.
MWM3050nQ
MWM3050nQ

This MWM3050nQ pursues to slice a wafer of more than 8" for solar cell with a stable cutting accuracy The world's first NC cutting program installed to the machine allows various and detailed cutting process.

Maximum work size : 12" x L450 x 1 piece
MWM6500SS
MWM6500SS

This machine slices wafers for solar cell with advantage of a high productivity and cost cutting.

Maximum work size : 156 x L500 x 4 pieces
PV800S & PV600S
PV800S & PV600S

These machines are enjoying a favorable comment worldwide as the cutting machines for solar cel wafers. The machines are designed in details so that they are easy to use and shortening a cutting time with a high yield. In addition. These machine can accept a dismond wire to cut.

Maximum work size : PV800S 156 x L840 x 1 piece
PV600S 156 x L660 x 1 piece
MBS1000
MBS1000

This machine is called "Multi-Block Slicer " , which cuts an ingot for a solar cell in cubes. MBS1000 allows mass production, and less kerf loss compare with conventional band-saw cutting.

Maximum work size : 1000 x H500 x 1 piece
8" x H500 x 16 pieces
6" x H500 x 25 pieces
MWM442DM
MWM442DM

This wire saw was designed for slicing semiconductor wafers and solar cell wafers as well as wafers of small diameter. Easy to use because of a compact design is well accepted and appreciated to be a best-selling machine.

Maximum work size : 156 x L300 x 2 pieces
MWM242DM
MWM242DM

This wire saw was desgined to cut hard materials like sapphire and ceramics by using diamond wire. Features and technology of best-selling machine, MWM442DM are adopted to this machine, MWM242DM to realize a high speed slicing and slicing accuracy.

Maximum work size : 160 x L300 x 1 piece
MWM650SQ and MWM1000SQ
MWM650SQ and MWM1000SQ

These series are designed for slicing a quartz which is used as liquid crystal mask substrate. NTC's original technology allows wafer of one ( 1 ) square meter in diameter to be sliced. MWM650SQ is used for cutting target materials.

Maximum work size : MWM650SQ 650 x L400 x 1 piece
MWM1000SQ 1100×L350×1 piece
Slurry Recycle System CSR System
Slurry Recycle System CSR System

This system removes cutting chips from wasted slurry ( Mixture of cutting chips, abrasive grain, and oil ) to recycle slurry used by MWM series.The system can protect environment and cut off a runninb cost remarkably . This full automation equipment can supply this recycled slurry to a wire saw. This system can be designed only by a wire saw manufacturer.
PAGE TOP